Improving reliability and performance of RF ICs with advanced EDA technology

Angelena Iglesia

Introduction With recent advancements in process technology, such as the development of high resistivity substrates, the integration of passive devices on-die, and the integration of bipolar junction transistors (BJTs) and complementary metal-oxide-semiconductor (CMOS) technologies into a new BiCMOS technology, combined with general technology scaling, the integration of RF components has […]